Project Description

High Density Interconnect PCB

1. Use 1/3 CMOS sensor, support analog hd video 700TVL
2. High speed, long distance, real time transmission
3. High performance noise reduction algorithm is adopted to improve low illumination performance
4. Mirror/ Normal image switch, distance label selectable to be open or closed

1/3 CMOS third brake light camera

Original design third brake light camera for Volkswagen VW transporter T5 T6 2015 to present for wholesale from China manufacturer, adopt 700TVL high resolution CMOS sensor, the 1.7mm lens enable 150° super wide viewing angle and effectively eliminate rear view blind spots, completely weatherproof with a IP69K rating, the complete package comes with all the wires, connectors and mounts you will need to improve driving  safety without changing the Volkswagen transporter original look.

  • High density pcb 10LHigh Density Interconnects pcb (HDI pcb) are utilized to meet the market demand for complex designs in smaller form factors across the majority of market
    segments. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit
    boards (PCB).
    They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.

    General Information for High density pcb (HDI PCB)

    HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb.An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB.
    HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.

    High Density PCB is used extensively in applications and industries including:

    ● Cell phone ● GPS
    ● Telecom ● ASemiconductor
    ● Automotive ● Military
    ● Medical ● Instrumentation

    1. 6L HDI printed circuit board for Intercom

    intercom hdi pcb6L High density PCB (HDI PCB) for intercom
    Board dimensions: 110 x 166mm
    Finished board thickness: 1.2mm
    Material: FR-4 Tg150
    Minimum holes size: 0.1mm
    Minimum line width/clearance: 3.5/3.5mil
    Copper thickness: 1oz
    Solder mask: top and bottom (color: green)
    Silkscreen: top (color: white)
    Finish: immersion gold (top and bottom)
    Board stack up: 1 + 4 + 1

    2. 6 Layers HDI PCB

    6L High density PCB (HDI PCB) for intercom
    Board dimensions: 80 x 120mm
    Finished board thickness: 1.0mm
    Material: FR-4 Tg150 halogen free
    Minimum holes size: 0.1mm
    Minimum line width/clearance: 2/3mil
    Copper thickness: T oz (12um)
    Solder mask: top and bottom (color: Blue)
    Silkscreen: top (color: white)
    Finish: immersion gold (top and bottom)
    Board stack up: 1 + 4 + 1

    3. 8L Cell phone HDI board PCB

    8layers High density PCB (HDI PCB) for cell phone
    Base material: FR4, Tg150
    Layer count: 8 layers (HDI PCB)
    Surface finishing: immersion gold
    Board thickness: 1.0mm
    Copper thickness: 0.5oz
    Minimum line width: 0.075mm
    Minimum line spacing: 0.075mm
    Laser drilling + blind and buried drilling Impedance control
    Stack up: 1+6+1

    4. 10L High density printed circuit board

    10L High density printed circuit board10layers HDI PCB
    Base material: FR4, Tg170
    Surface finishing: immersion gold
    Board thickness: 1.0mm
    Copper thickness: 0.5oz
    Minimum line width: 0.1mm
    Minimum line spacing: 0.1mm
    Laser drilling + blind and buried drilling Impedance control
    Board stack up: 1+8+1
    Impedance control

    5. 10L High Density Interconnect pcb

    10L High Density Interconnect PCB10L High Density Interconnect board
    Laminate: FR4, Tg150
    Board thickness: 1.6mm
    Copper thickness: 17.5um (Hoz) for all layers
    Solder resist: green color
    Surface Finish: Immersion gold
    Trace width/width: 0.89/0.1mm
    Min. holes:0.1mm
    Controlled Impedance
    Board stack up: 1+1+6+1+1
    Application: Industry control

    6. 10L stage 2 Automotive HDI PCB

    Layer count: 2 stage 10 layer
    Board thickness:1.0mm
    Dimension:160*130mm
    Raw material:FR4 EM825
    Copper thickness on the board surface:≥35um
    Copper thickness in the hole barrel:20um
    Min.line width/space:0.075mm
    Minimum hole diameter:0.1mm
    Surface finishing:immersion gold≥2u”
    Application:automotive driving recorder

    7. 10L every layer interconnection(ELIC) HDI PCB

    Layer count:  10 layer
    Board thickness:0.80mm
    Raw material:FR4 370HR
    Min.line width/space:0.075/0.075mm
    Minimum hole diameter:0.10mm
    Surface finishing:ENIG
    Plug via-in-pad by resin and plate flat

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