Project Description

24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China

1. Use 1/3 CMOS sensor, support analog hd video 700TVL
2. High speed, long distance, real time transmission
3. High performance noise reduction algorithm is adopted to improve low illumination performance
4. Mirror/ Normal image switch, distance label selectable to be open or closed

1/3 CMOS third brake light camera

Original design third brake light camera for Volkswagen VW transporter T5 T6 2015 to present for wholesale from China manufacturer, adopt 700TVL high resolution CMOS sensor, the 1.7mm lens enable 150° super wide viewing angle and effectively eliminate rear view blind spots, completely weatherproof with a IP69K rating, the complete package comes with all the wires, connectors and mounts you will need to improve driving  safety without changing the Volkswagen transporter original look.

  • 24 layers High Density Interconnect PCB, HDI PCB Manufacturing HDI board China

    High Density Interconnects (HDI PCB) Board are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).

    HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.

    Hitechpcb maintains years of experience with HDI products and was a pioneer of second generation microvias. Now offer an entire family of microvia technology solutions for your next generation products.

    HDI Board General Information

    High Density Interconnects (HDI) board are defined as a board (PCB) witha higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 µm), I/O>300,   and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.

    HDI board is used to reduce size and weight, as well as to enhance electrical performance. According to layer up different, currently DHI board is divided into three basic types:

    1) HDI PCB (1+N+1)HDI PCB, High Density Interconnect PCB Features: Suitable for BGA with lower I/O counts Fine line, microvia and registration technologies capable of 0.4 mm ball pitch Qualified material and surface treatment for Lead-free process Excellent mounting stability and reliability Copper filled viaHDI PCB, High Density Interconnect PCB Application: Cell , UMPC, MP3 Player, PMP, GPS, Memory Card1+N+1 HDI PCB Structure:

    2) HDI PCB (2+N+2)HDI PCB, High Density Interconnect PCB Features: Suitable for BGA with smaller ball pitch and higher I/O counts Increase routing density in complicated design Thin board capabilities Lower Dk / Df material enables better signal transmission performance Copper filled viaHDI PCB, High Density Interconnect PCB Application: Cell , PDA, UMPC, Portable game console, DSC, Camcorder

    HDI PCB Capabilities

    Layers3 – 36 Layers

    HDI Step 3+N+3

    Min.Line Width0.05mm (2 mil)

    Min.Line Space0.05mm (2 mil)

    Min.Annular ring0.1mm (4 mil)

    Min. Via0.1mm (4 mil)

    Max.Size500mm X 800mm

    MaterialFR4,High Tg220

    Material thickness Start at 25um Plus copper

    Copper thickness0.3 OZ to 10 OZ (10um – 350um)

    Please contact us for more information about HDI PCB Board.

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