PCB prototyping assembly and clone service

//PCB prototyping assembly and clone service

PCB prototyping assembly and clone service

Technical description

PCB prototyping assembly and clone service

  • Material: FR4 TG135
  • Layer/Thickness: 2L/1.60mm
  • Outer Copper:1/1 OZ
  • Surface treatment: Immersion siliver
  • Min. Hole Size:0.30mm
  • Min. Line Width:0.30mm
  • Min. Line Spacing:10mile
  • Technical featuer: rigid
  • Application field: automotive electronics usb
By | 2017-04-28T15:46:27+00:00 April 28th, 2017|Industry News|Comments Off on PCB prototyping assembly and clone service

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