Impact Assessment of Batch Process of 40Z and above (Inclusive) Copper Thickness of Heavy Copper PCB

//Impact Assessment of Batch Process of 40Z and above (Inclusive) Copper Thickness of Heavy Copper PCB

Impact Assessment of Batch Process of 40Z and above (Inclusive) Copper Thickness of Heavy Copper PCB

 

heavy copper pcb

 

Today I will share the impact assessment of batch process of 40Z and above (inclusive) copper thickness of heavy copper PCB with you. Hope it will be helpful to you.

Note: indicates no effect; indicates a certain influence; indicates a direct effect.

 

ItemsCategoryInfluenceInfluence degree
1 Inner layerAt present, 4OZ and above (inclusive) copper thickness material codes of the inner layer circuit is made from outer dry film.
2 Lamination4OZ and above material codes need to use special PP for filter processing
3 DrillingDrill pinhole limit is reduced, corresponding drill consumption increased
4 ElectroplatingExcept for the special high aspect ratio material number, others can be normal operating conditions
5 Dry filmCorresponding inner circuit is made from outer dry film, the production capacity need to be considered
6 EtchingIn order to reduce the difference between the upper and the lower line, multiple etching is needed, and the corresponding etching speed needs to be reduced
7 Anti-weldingThe inner thick copper parts have no effect, and the outer thick copper anti welding is required 2 times printing to avoid skip printing and air bubbles
8 CharactersPay attention to the oil condition of the character on the shoulder of the circuit
9 Spray tinThe heavy copper PCB is weightier than ordinary products, be aware of scratching
10 Forming
11 Test
12 Visual inspection

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By | 2016-09-23T06:46:29+00:00 September 23rd, 2016|Product Knowledge|Comments Off on Impact Assessment of Batch Process of 40Z and above (Inclusive) Copper Thickness of Heavy Copper PCB

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